Copper(II) tetrafluoroborate, Cu(BF4)2, [38465-60-0], MW 237.15, is also known as copper fluoborate. It is usually sold as a concentrated solution and it is prepared by the neutralization of tetrafluoroboric acid with basic copper(II) carbonate or copper(II) hydroxide.
Copper(II) tetrafluoroborate is used in copper plating and in the production of printed circuits. It serves as an intermediate for homometallic, trinuclear heteroscorpionate complexes applied in studies of electronic and magnetic properties. It is also employed in the promotion of Diels-Alder reactions and decomposition of diazo compounds. Further, it is used as a component of fluxing and plating, as a catalyst and as an active filler in resin bonded abrasives. It is used in flame-retardant production, metal treatment, grain refining agents, electrolytic generation of boron and in the preparation of glazing frits. In addition it functions as an oxidizing agent and reacts with siloxycyclopropanes to generate beta acylalkylcopper(II) species.
Copper(II) borofluoride is used primarily in the circuit board industry and in copper plating.
Dark-blue odorless aqueous solution. Sinks and mixes with water.
Copper(II) borofluoride may corrode some metals [USCG, 1999].
Inhalation of mist irritates nose and throat. Ingestion causes pain and vomiting. Contact causes severe irritation of eyes and irritation of skin.
Special Hazards of Combustion Products: Irritating hydrogen fluoride gas may form in fires.
