Performance & Application
Specially used as a corrosion inhibitor for copper and copper
alloys in the semiconductor, microelectronics, display and printed
circuit board industries, it also has corrosion inhibition effect on
ferrous metals. By adsorption on the surface of copper to form a
thin film, so as to protect and control the etching and corrosion of
copper surface treatment process, but also can be used as a
pharmaceutical intermediate for the synthesis of cefteram piamyl
axel side chain.
Technical Data Metal Content Index（ ICP-OES）
www.boray-chem.com
Metallic Element Data
Fe <5 ppm
Zn <1 ppm
Mn <1 ppm
Mg <3ppm
Pb <3 ppm
Cr <1 ppm
Cu <1 ppm
Ni <1 ppm
Ca <5ppm
Al <5 ppmBoray-Chem (Shanghai) New Material Co., Ltd.
Ba <5 ppm
Na <50 ppm
Usage
Dissolve with alcohol or weak acid solution and add to the
etching solution or cleaning solution, the concentration of this
product in the system is recommended to be 0.5-20mg /L, the
amount of addition is adjusted according to the specific use.
Packing & Storage
Packed in composite plastic woven bags, placed in wooden drums,
each bag net weight 25kg, beware of moisture, high temperature and
sunlight, storage period of 12 months.
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