Polyimide films (thickness 0.025 mm) can be used in capacitors, flexible printing circuits boards, insulation materials, and also in optoelectronic applications, such as transparent conductive film, transparent substrates for flexible display, and flexible solar cells. It is also used for the fabrication of flexible copper-clad laminates (FCCLs) for advanced microelectronic assembly.
Polyimides are an important class of high-temperature engineering polymers that consist of aromatic dianhydrides and diamine monomers. These polymers are well known for their high-temperature stability, mechanical strength, chemical resistance, and excellent dielectric properties. These characteristics of the polyimides make them an ideal candidate for aerospace, flexible printed circuits, electrical insulation, high-temperature mechanical seals, photovoltaic modules, high-density electronic interconnects, and many other electronic applications. Polyimides are also used in medical tubing applications because of their high flexibility, high tensile strength, biocompatibility, low friction, transparency, smooth surface, and they can be sterilized via gamma, EtO, and e-beam sterilization methods.
(KAPTONE) Polyimide is related to aromatic polyamide, butwith additional aromatic groups. Expensive toproduce, it can be made in films down to 25μm thick, and in varnish form for wire coating. It isvery tough, does not burn but chars above 800°C,and remains flexible at liquid helium temperatures;it can be used continuously up to 250°C.
