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SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS)

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SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS)

中文名称:SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS)
英文名称:SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS)
CAS号:
分子式:H4Si
分子量:32.11726
EINECS号:
Mol文件:Mol File
SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS) 结构式
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