SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS)
- CAS号:
- 英文名:SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS)
- 中文名:
- CBNumber:CB4660095
- 分子式:H4Si
- 分子量:32.11726
- MOL File:Mol file
SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS)上下游产品信息
上游原料
下游产品
SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS)生产厂家
