| Melting point |
1410 °C(lit.) |
| Boiling point |
2355 °C(lit.) |
| bulk density |
0.07-0.08g/cm3 |
| Density |
2.33 g/mL at 25 °C(lit.) |
| Flash point |
2.33 |
| storage temp. |
Flammables area |
| solubility |
insoluble in H2O, acid solutions; soluble in alkaline solutions |
| form |
powder |
| Specific Gravity |
2.42 |
| color |
White |
| PH |
13.5 (H2O, 20°C) |
| Odor |
Odorless |
| Water Solubility |
INSOLUBLE |
| Electrical Conductivity |
1000 S/m |
| Thermal Conductivity |
150 W/(m·K) |
| semiconductor properties |
<111>P-type |
| Specific Heat Capacity |
Cp(crystal): 0.62 J/(g·K); Cp(gas): 0.69 J/(g·K), at 25℃ |
| Sensitive |
Air Sensitive |
| Crystal Structure |
Cubic, Diamond Structure - Space Group Fd3m |
| Merck |
13,8565 |
| Exposure limits |
ACGIH TLV-TWA:2.5 mg/m3
OSHA PEL-TWA:15 mg/m³ (total dust),5 mg/m³ (respirable fraction)
NIOSH REL-TWA:10 mg/m³ (total dust),5 mg/m³ (respirable fraction);REL-IDLH:250 mg/m3 |
| Dielectric constant |
2.4（Ambient） |
| Stability |
Stable. Fine powder is highly flammable. Incompatible with oxidizing agents, bases, carbonates, alkali metals, lead and aluminium oxides, halogens, carbides, formic acid. |
| Cosmetics Ingredients Functions |
ABRASIVE |
| InChI |
1S/Si |
| InChIKey |
BLRPTPMANUNPDV-UHFFFAOYSA-N |
| SMILES |
[Si] |
| Bulk Modulus |
98.74 GPa |
| Hardness, Mohs |
7.0 |
| Modulus of Elasticity |
112.4 GPa |
| Poissons Ratio |
0.28 |
| Knoop Microhardness |
11270, N/mm2 Microhardness |
| Shear Modulus |
43.9 GPa, Calculated |
| CAS DataBase Reference |
7440-21-3(CAS DataBase Reference) |
| NIST Chemistry Reference |
Silicon(7440-21-3) |
| EPA Substance Registry System |
Silicon (7440-21-3) |
