이량체,파릴렌F

이량체,파릴렌F 화학적 특성, 용도, 생산

• 개요

  Parylene F Dimer is the solid, granular starting material used to produce parylene conformal coating films. Parylene F brings allows for parylene performance at higher operating temperatures, along with similar barrier and dielectric protection of other parylene types.

• 물리적 성질

  TYPICAL PROPERTIES OF DEPOSITED PARYLENE F FILM
  Gas Permeability, O2: 16.7 (cc*mm)/(m2*day*atm)
  Short Term Service Temperature: 250℃
  Continuous Service Temperature: 200℃
  Coefficient of Friction (Static and Dynamic): 0.35
  Rockwell Hardness: R80
  Tensile Strength: 7,800 psi
  Penetration Power: 30 X
  Dielectric Strength @ 1 mil: 7.0 KV
  USP Class VI Polymer: Yes

• 용도

  Parylene type materials have been widely used in electronic products, Parylene family of commercially valuable types of materials are divided into four types, respectively, Parylene N, Parylene C, Parylene F, Parylene Ht.
  Parylene is applied with a vapor deposition process performed in a customized vacuum system. There is no curing involved. Typical coating thickness ranges from 2-50 microns.
  Barrier layer protection for high temperature applications.
  Protects devices from moisture, bodily fluids, corrosive gases, vapors, liquids and other contamination.
  Waterproof electronics up to IPX8 protection level and meet requirements for IPC, MIL specs and NASA standards.
  Prevents corrosion of printed circuit boards and electronic components.
  Dielectric layer to protect electronics from shorts and arcing.
  Thin film encapsulation is used to protect electronics from vibration or shock.
  Tin whisker mitigation

• benefits

  Parylene F film meets all requirements of MIL-I-46058C, IPC-CC-830B and NASA-STD-8739.1 as type XY
  USP Class VI biocompatibility
  UL-94 V-0 flammability rating
  No VOC's or solvents used in deposition process
  RoHS and REACH compliant
  Vapor deposition has a high penetration power and is extremely conformal
  Deposition occurs in a vacuum chamber occurs at room temperature and does not exert any force during deposition
  No curing cycle
  Excellent barrier and dielectric properties
  Chemically and biologically inert
  Extremely thin and lightweight coating
  No outgassing, approved by NASA
  Hydrophobic
  Able to sterilize with all common sterilization methods

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