54208-63-8

Name 2,2'-[methylenebis(o-phenyleneoxymethylene)]bisoxirane
CAS 54208-63-8
EINECS(EC#) 259-026-8
Molecular Formula C19H20O4
Molecular Weight 312.36
MOL File 54208-63-8.mol
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Chemical Properties

Boiling point  453.4±25.0 °C(Predicted)
density  1.213±0.06 g/cm3(Predicted)
Contact allergens
Epoxy resins based on Bisphenol F, also called phenolic Novolac, contain bisphenol F diglycidyl ether, which has three sensitizing isomers. DGEBF has a greater resistance than DGEBA. Contact allergy to bisphenol-F-based epoxy resins is rarer than that due to bisphenol-A-based resins and is frequently acquired with flooring materials and putty.
EPA Substance Registry System Methylenebis[2-gylcidyloxyphenyl] (54208-63-8)

Safety Data

Symbol(GHS)  Exclamation Mark (GHS07)
GHS07
Signal word  Warning
Hazard statements  H319-H411-H317-H315
Precautionary statements  P264-P280-P302+P352-P321-P332+P313-P362-P264-P280-P305+P351+P338-P337+P313P-P261-P272-P280-P302+P352-P333+P313-P321-P363-P501
TSCA  TSCA listed

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