CMP级超过纯硅溶胶

特点（FEATURE）：
    1.本产品以高纯硅酸酯为原料，采用sol-gel法合成的超过纯硅溶胶；
    Our Silica Sol is made of high purity silicate ester, and is synthesized by sol gel method.
    2.总金属杂质500ppb以下；
     The total metal impurities are below 1ppm.
    3.可以自由控制粒子的粒径及缔合度；
     The particle size and association of particles can be controlled freely.
    4.产品稳定，长时间无沉降。
     The product is stable for a long time.

用途（UASES）：
    广泛应用于半导体、液晶领域，用于改进耐磨性，气体阻隔性等。
    Apply to semiconductor and liquid crystal field with improved scuff resistance, and     gas–barrier property.
    如硬盘抛光、光学玻璃抛光、加硬液、各种涂层材、彩谱分离用充填材、陶瓷粘合剂、
    喷墨用纸、高效催化剂载体等等。
    Such as Hard Disk Polishing, Optical Glass Polishing, Hard liquid, Coating Materials,     Filling Materials for Color Spectrum Separation, Ceramic Adhesives, Ink Jet Paper, Efficient     Catalyst Carrier and so on.

包装(PACKING)：
    根据客户要求提供。
     Provide according to customers’ requirements.

保存和保质期（SHELF LIFE）:
   密封保存，保质期6个月。
    Keep tightly closed. Avoid moisture. Store at cool and dry place.
    Shelf Life is 6 months.