curing agent for epoxy resins

DCD-S5
461-58-5

上海更新日期：2015-08-04

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非会员

联系人：Lisa Li

电话：021-60560161拨打

邮箱：info@dicyandiamidechina.com

产品详情:

中文名称：: curing agent for epoxy resins

英文名称：: DCD-S5

CAS号：: 461-58-5

Molecular Formula: C₂H₄N₄ Molecular Weight:84.08

CAS No.:461-58-5

Properties:：
Micro-Dicyandiamide is free flowing White powder.
Micro-Dicyandiamide is an ultra-micronized grade of dicyandiamide containing 1.5% of anti-blocking agent to prevent clumping and improve application. Micro-dicyandiamide is designed for use as a latent agent for epoxy resins.
The fine particle size of Micro-dicyandiamide provides enhanced reactivity in epoxy resin.
Micro-dicyandiamide is easily dispersed in liquid resins.

Specification:

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Items

Index

Appearance

Free Flowing White Powder

Purity (%)

97.5 min

Free Water (%)

0.3 max

Melt Point (°C)

209-212

Particle Size (98%)［µm］

10μm max

Dispersant (%)

1.5 max

Usage:

1. Micro-dicyandiamide can be used as One Component Adhesives

2. Micro-dicyandiamide can be used as Epoxy Powder Coatings

3. Micro-dicyandiamide can be used as Prepregs and Film Adhesives

4.Micro-dicyandiamide can be used as Electronic Potting and Encapsulating Compounds

Package and Storage: Net weight 25kg, 500kg, 1000kg poly woven bag, or other package

CURING AGENT FOR EPOXY RESINS MANUFACTURER

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主营行业	中间体,化学试剂,农药中间体,染料中间体,纺织用化学品