BERGQUIST HF300P HI-FLOW THF 1600P HI-FLOW 300P

BERGQUIST HI-FLOW THF 1600P  Features and Benefits

• Thermal impedance: 0.13°C-in.2/W

(at 25 psi)

• Field-proven polyimide film; excellent

dielectric performance; excellent cutthrough

resistance

• Outstanding thermal performance in an

insulated pad

BERGQUIST HF300P  HI-FLOW 300P  HI-FLOW THF 1600P

BERGQUIST HI-FLOW THF 1600P consists of a thermally conductive 55°C phase change compound

 coated on a thermally conductive polyimide film. The polyimide reinforcement makes the material easy

to handle and the 55°C phase change temperature minimizes shipping and handling problems.

BERGQUIST HI-FLOW THF 1600P achieves outstanding values in voltage breakdown and thermal 

performance. The product is supplied on an easy release liner for exceptional handling in high

volume manual assemblies. BERGQUIST HI-FLOW 300P is designed for use

as a thermal interface material between  electronic power devices requiring electrical isolation to the 

heat sink.

BERGQUIST  HF300P Typical Applications Include:

• Spring or clip-mounted

• Discrete power semiconductors and modules

Configurations Available:

• Roll form, die-cut parts and sheet form, dry both sides