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  • BERGQUIST GPHC5.0 GAP PAD HC5.0 GAP PAD TGP HC5000
  • BERGQUIST GPHC5.0 GAP PAD HC5.0 GAP PAD TGP HC5000

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BERGQUIST GPHC5.0 GAP PAD HC5.0 GAP PAD TGP HC5000

BERGQUIST GPHC5.0 GAP PAD HC5.0 GAP PAD TGP HC5000
询价 5sheet 起订
广东 更新日期：2023-06-28

深圳市华思瑞科技有限公司

非会员
联系人：Carrie
电话：13798203669拨打
手机：13798203669 拨打
邮箱：Carrie@hothree.com

产品详情:

中文名称：
导热硅胶垫片
英文名称：
BERGQUIST GPHC5.0 GAP PAD HC5.0 GAP PAD TGP HC5000
品牌：
BERGQUIST
产地：
US
产品类别：
GAP PAD
型号：
GPHC5.0
外形尺寸：
203*406MM

    Features and Benefits

    • Thermal conductivity: 5.0 W/m-K 

    • High-compliance, low compression stress 

    • Fiberglass reinforced for shear and  tear resistance

BERGQUIST GAP PAD TGP HC5000 (Thermal Conductivity Silicone Sheet)is  a soft and compliant gap filling material  with 

a thermal conductivity of 5.0 W/m-K.  The material offers exceptional thermal  performance 

at low pressures due to a  unique filler package and low-modulus resin  formulation. 

The enhanced material is ideal  for applications requiring low stress on  components 

and boards during assembly.  BERGQUIST GPHC5.0(Thermal Conductive Insulating Silicone Gasket) maintains a conformable 

nature that  allows for excellent interfacing and wet-out  characteristics, even to surfaces with 

high  roughness and/or topography. BERGQUIST GAP PAD HC5.0 (Thermal Silicone Pad)is  offered with 

natural inherent tack on both  sides of the material, eliminating the need  for thermally-impeding 

adhesive layers.  The top side has minimal tack for ease of  handling. BERGQUIST GAP PAD TGP  HC5000 

is supplied with protective liners on both sides.


BERGQUIST GPHC5.0;GAP PAD HC5.0;GAP PAD TGP HC5000;

公司简介

Shenzhen Hothree Technology Co., Ltd. was established in 2011. It is a technology-oriented company that is oriented to customer needs and is committed to providing customers with professional solutions for thermal conduction and EMI electromagnetic compatibility problems. The company mainly distributes thermal interface materials and shielding (EMI) materials for well-known brands such as Bergquist ,LAIRD in the US and Denka in Japan. At the same time, the company is also developing and integrating new high-performance products to meet system designers' requirements for thermal conductivity. Products are widely used in 5G communications, optical modules, security electronics, automotive electronics, outdoor base stations, lithium batteries, mobile phones, computers, LED, instruments, aerospace and medical equipment. Company culture, Integrity and pragmatism, quick response, keep improving.

成立日期 (13年)
注册资本 300万人民币
员工人数 1-10人
年营业额 ￥ 1000万-5000万
经营模式 贸易
主营行业 聚合物材料,特种纤维及高功能材料,工业胶水

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