BERGQUIST GPVOUS GAP PAD TGP 1000VOUS GAP PAD VO Ultra Soft

Features and Benefits

• Thermal conductivity: 1.0 W/m-K

• Highly conformable, low hardness

• “Gel-like” modulus

• Decreased strain

• Puncture-, shear- and tear-resistant

• Electrically isolating

BERGQUIST GPVOUS, Thermal Conductive Sheet, Silica Gel Cooling Pad

GAP PAD TGP 1000VOUS, Silicone Thermal Pad For Converter

GAP PAD VO Ultra Soft  Interface Pad Heat Transfer Materials

BERGQUIST GAP PAD TGP 1000VOUS(GPVOUS)  is recommended for applications that  require a minimum amount of pressure

on components. The viscoelastic nature  of the material also gives excellent lowstress  vibration dampening and shock

absorbing characteristics. BERGQUIST GAP PAD TGP 1000VOUS is an  electrically isolating material, which allows its use 

in applications requiring  isolation between heat sinks and highvoltage,bare-leaded devices.

BERGQUIST GAP PAD VO Ultra Soft  Typical Applications Include:

• Telecommunications

• Computers and peripherals

• Power conversion

• Between heat-generating semiconductors or magnetic components and a heat sink

• Areas where heat needs to be transferred to a frame, chassis, or other type of

heat spreader

Configurations Available:

• Sheet form and die-cut parts