- COPPER POWDER, -100 MESH, 99% (METALS BASIS)
- 99268-54-9 copper(II)-N-salicyloyl-N'-(2-furylthiocarbonyl)hydrazine
- copper gallium diselenide
- 59778-91-5 Copper, di-.mu.-chlorobis(dipropylcarbamodithioato-.kappa.S,.kappa.S)di-
- Copper(II) nitrite
- 锑化二铜
- Copper(II) trihydroxide ion(-1)
- 66923-66-8 乙酸铜
- 72480-58-1 Copper, diazotized 2-amino-1,4-benzenedisulfonic acid-diazotized 2-[(4-aminophenyl)amino]-5-nitrobenzenesulfonic acid-diazotized 4-nitrobenzeneamine-Dyer's mulberry extract coupling products complexes
- COPPER WIRE, 0.025MM (0.001IN) DIA, PURATRONIC®, 99.995% (METALS BASIS)
- 12069-69-1 碱式碳酸铜
- 660-60-6 硬脂酸铜
- COPPER NAPHTHENATES SOLUTION 100UG/ML IN ACETONITRILE 1ML
- 80056-12-8 Copper-67(II) chloride
- 85187-41-3 copper(2+) glycerol phosphate
- copper(2+) heptanoate
- 2-Copper 1-magnesium
- COPPER ETHYLHEXANO-ISOPROPOXIDE
- Copper(II) di(N.N-diethanolamine) ion(+2)
- 124719-24-0 Copper, 29H,31H-phthalocyaninato(2-)-N29,N30,N31,N32-, sulfo 3-(trimethylammonio)propylaminosulfonyl derivs., Me sulfates, sodium salts
- 14721-21-2 二氯酸铜盐
- copperhead venom procoagulant enzyme
- 重铬酸铜
- 135821-00-0 copper dichlorate tetrahydrate
- 69140-61-0 copper dipotassium (1-hydroxyethylidene)bisphosphonate
- COPPER WIRE, 1.0MM (0.04IN) DIA, PURATRONIC®, 99.999% (METALS BASIS)
- COPPER (II) SULFATE, MONOHYDRATE
- Copper(II) diethylenediamine ion(+2)
- 10060-13-6 氯化铜铵二水物
- 10031-43-3 硝酸铜三水合物
- COPPERPLASMAEMISSIONSTANDARD,1ML=10MGCU
- COPPERSULFATE,10%(W/V)SOLUTION
- 127913-88-6 copper-thiosemicarbazone complex
- Copper(II) mono(L-alpha-alanine) ion(+1)
- 7798-23-4 磷酸铜(2+)(2:3)
- COPPER - 4% HNO3 100ML
- Copper(II) orthophosphate trihydrate
- 123333-88-0 三氟乙酸铜水合物
- 22992-96-7 copper palmitate
- copper thionein
- copper platinum chloride
- 540-16-9 丁酸铜
- Copper(II) ion(+2)
- COPPER-COUNT(R)-N
- 13587-24-1 copper hydrogen phosphate
- 16048-96-7 水杨酸铜
- 142-71-2 醋酸铜
- Copper(II) tri(diethanolmethylamine) ion(+2)
- Copper(II) di(L-alpha-alanine)
- 7440-50-8 Copper
- COPPER(II) BROMIDE, ANHYDROUS
- COPPER POWDER, -625 MESH, APS 3.25-4.75 MICRON, 99.9% (METALS BASIS)
- 17652-46-9 吡硫鎓铜
- 32276-75-8 copper(2+) 2,2-dimethyloctanoate
- COPPER TURNINGS, 99+% (METALS BASIS)
- 7789-45-9 Copper(II) bromide
- COPPER DIMETHYLAMINOETHOXIDE/ 99.9%
- Copper Radioisotopes
- Copper oxide,30-50nm APS powder
- COPPER POWDER, -625 MESH, APS 0.75-1.5 MICRON, 99% (METALS BASIS)
- 53383-24-7 CopperLysinate3%
- Copper (II) sulfate hydrate
- 14875-91-3 新铜试剂项目
- 125769-67-7 邻亚二甲苯基二(N,N-二异丁基二硫代氨基甲酸酯)
- COPPER HISTIDINATE
- Copper(II) monohydroxide ion(+1)
- COPPER-(II)-CITRATE DIHYDRATE
- COPPER SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 3.18MM (0.125IN) THICK, 99.999% (METALS BASIS)
- Copper silicofluoride
- CopperPigment
- Copper&BrassDip
- Copper(II) hydrogen citrate
- 邻氨基(苯)酚铜盐
- Copper(II) DTPA ion(-3)
- 5893-71-0 酒石酸铜
- COPPER PEPTONATE
- COPPER POWDER, -40+100 MESH, 99.5% (METALS BASIS)
- 55072-57-6 Copper-zinc sulfate complex
- COPPER (II) SULFATE, ANHYDROUS
- 14984-71-5 亚硝酸铜
- Copper(I) selenide
- 10257-54-2 一水合硫酸铜
- 7144-37-8 copper bis(4-toluenesulphonate)
- 铜
- 14958-34-0 氧化钒铜
- 155773-67-4 5,9,14,18,23,27,32,36-八丁氧基-2,3-萘酞菁铜(II)
- 93918-23-1 copper(2+) neoundecanoate
- 11108-64-8 铜铍合金棒
- Copper Sulfate Suspension 10%
- 钨酸铜
- 55671-32-4 Copper, ethanedioato(2-)-.kappa.O1,.kappa.O2-, hydrate (2:1)
- COPPER 1,000 PPM ICP STANDARD SOLUTION
- COPPER SHOT, 0.8-2MM (0.03-0.08IN), 99.5% (METALS BASIS)
- COPPER FOIL, 0.05MM (0.002IN) THICK, ANNEALED, 99.8% (METALS BASIS)
- COPPER-LEAD ALLOY
- COPPER 2 PPM STANDARD SOLUTION
- 饱和硫酸铜溶液
- CopperSebicate13%CuPowder,Copper(MetallicElement)
- 1317-38-0 Copper(II) oxide
- COPPER SLUG, 6.35MM (0.25IN) DIA X 12.7MM (0.50IN) LENGTH, 99.996% (METALS BASIS)
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