Code |
Alloy |
Solidify and fluidity Temperature ºC |
Bar | Solder Wire (Φ0.3~12mm) | SMT Paste |
| Single-core | Three-core | Water-soluble |
| SP70-30 | Sn70Pb30 | 183 193 | √ | √ | √ | √ | X |
| SP63-37 | Sn63Pb37 | 183 | √ | √ | √ | √ | √ |
| SP60-40 | Sn60Pb40 (Sb0.3-0.8) | 183 190 | √ | √ | √ | √ | X |
| SP55-45 | Sn55Pb45 (Sb0.3-0.8) | 183 203 | √ | √ | √ | √ | X |
| SP50-50 | Sn50Pb50 (Sb0.3-0.8) | 183 215 | √ | √ | √ | √ | X |
| SP45-55 | Sn45Pb55 | 183 227 | √ | √ | √ | √ | X |
| SP40-60 | Sn40Pb60 | 183 238 | √ | √ | X | √ | X |
| SP35-65 | Sn35Pb65 | 183 248 | √ | √ | X | √ | X |
| SP30-70 | Sn30Pb70 (Sb1.5-2.0) | 183 258 | √ | √ | X | √ | X |
| SP25-75 | Sn25Pb75 (Sb1.5-2.0) | 183 260 | √ | √ | X | √ | X |
| SP20-80 | Sn20Pb80 | 183 279 | √ | √ | X | √ | X |
| SP18-82 | Sn18Pb82 (Sb1.5-2.0) | 183 279 | √ | √ | X | √ | X |
| SP10-90 | Sn10Pb90 | 268 301 | √ | √ | X | √ | X |
| SP5-95 | Sn5Pb95 | 300 314 | √ | √ | X | √ | X |
| SP2-98 | Sn2Pb98 | 316 322 | √ | X | X | X | X |
| SPA63-1.4 | Sn62.5Pb36.1Ag1.4 | 178 180 | √ | √ | √ | √ | X |
| SPA50-2 | Sn50Pb48Ag2 | 178 | √ | √ | √ | √ | X |
| PA97.5-2.5 | Pb97.5Ag2.5 | 304 | √ | X | X | X | X |
| PA95-5 | Pb95Ag5 | 304 365 | √ | X | X | X | X |
| SPA0.75-1.75 | Sn0.75Bp97.5Ag1.75 | 310 313 | √ | X | X | X | X |
| SPC50-17.5 | Sn50Pb32Cd17.5 | 145 145 | √ | √ | X | X | X |
| SPC43-14 | Sn43Pb43Bi14 | 145 155 | √ | X | X | X | X |
| SPB16-52 | Sn16Pb32Bi52 | 100 | √ | X | X | X | X |
| SPA10-2 | Sn10Pb88Ag2 | 268 290 | √ | √ | X | X | X |
| SPA5-2.5 | Sn5Pb92.5Ag2.5 | 299 304 | √ | √ | X | X | X |
Tin made of new material,do not add the recovery of tin,tin slag.
The surface of solder bar is smooth and uniform,and the fluidity is good after melting.
Good wettability and extension ability,solder joint full light,iciclesvirtual and false welding phenomenon.
Adding high-effective antioxidant ingredients,strong antioxidant capacity.
It is resistant to tensile and shear.
The oxidation slag and other residues are very few,and the oxidation resistance is excellent,the purity is high,and it is easy to solder.
Suitable for wave soldering or hand immersion soldering,welding intensive circuit board,superior performance and high reliability.
The solder joint is bright and full,without false welding,false welding and tip pulling, and the combination is stable and firm.
It can effectively inhibit the growth of metal compounds (IMC). Reduce energy consumption,reduce unnecessary waste.
It is widely used in welding high precision circuit boards such as household appliances,communications,computers, instrumentation and other electronic products.
China
