SILICON SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS)
SILICON SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS)
英文名称:SILICON SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS)
CAS号:
分子式:H4Si
分子量:32.11726
EINECS号:
Mol文件:Mol File