SILICON SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 3.18MM (0.125IN) THICK, 99.999% (METALS BASIS)

Basic information Supplier

Basic information More

Product Name:SILICON SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 3.18MM (0.125IN) THICK, 99.999% (METALS BASIS)
Synonyms: SILICON SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 3.18MM (0.125IN) THICK, 99.999% (METALS BASIS)
CAS:
MF:H4Si
MW:32.11726
EINECS:
Mol File:Mol File

Browse by Nationality Suppliers >Global suppliers

Please select the suppliers
Recommend You Select Member Companies