EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION
Basic informationMore
- Product Name:EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION
- Synonyms: EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION
- CAS:
- MF:O**
- MW:15.9994
- EINECS:
- Mol File:Mol File
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- Company Name:ChangChun Plastics. Co. Ltd.
- Tel:(02)25001800
- Products Intro:
- CB Index:57
- Related Information:Catalog(83)