SILICON SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS)

한글명:SILICON SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS)

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상품명:SILICON SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS)

CBNumberCB0660097

분자식H4Si

포뮬러 무게32.11726

MOL 파일Mol file