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EPOXY

EPOXY Structure
EPOXY
  • CAS No.
  • Chemical Name:EPOXY
  • CBNumber:CB31416320
  • Molecular Formula:O**
  • Formula Weight:15.9994
  • MOL File:Mol file
Hazard and Precautionary Statements (GHS)
  • Symbol(GHS)
  • Signal word
  • Hazard statements
  • Precautionary statements

EPOXY Chemical Properties,Usage,Production

  • Uses Epoxy is a high-performance adhesive largely used in the electronics industry as well as for MEMS and microfluidic applications. Some epoxies are cured by exposure to UV light and are commonly used in optical applications and dentistry. After cure, epoxies form strong bonds and smooth surfaces chemically inert to a large range of chemical substances, making them a good choice as sealing material as well as microchannels structural material. The strength of the epoxy adhesion is usually degraded at temperatures above 180°C.
EPOXY Preparation Products And Raw materials
Raw materials
Preparation Products
Global(3)Suppliers
EPOXY Spectrum
  • 环氧树脂
  • 61788-98-4
  • 浇筑环氧树脂
  • EPOXY