Basic information
SILICON(IV) OXIDE SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 3.18MM (0.125IN) THICK, 99.995% (METALS BASIS) Structure

SILICON(IV) OXIDE SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 3.18MM (0.125IN) THICK, 99.995% (METALS BASIS)

Preparation Products And Raw materials