![SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS) Structure](https://www.chemicalbook.com/StructureFile/ChemBookStructure22/GIF/CB4660095.gif)
SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS)
- Product NameSILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS)
- CAS
- CBNumberCB4660095
- MFH4Si
- MW32.11726
- MOL FileMol file