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SILICON(IV) OXIDE SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.995% (METALS BASIS) Structure

SILICON(IV) OXIDE SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.995% (METALS BASIS)

SILICON(IV) OXIDE SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.995% (METALS BASIS) Price

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