SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 3.18MM (0.125IN) THICK, 99.999% (METALS BASIS)
- Product NameSILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 3.18MM (0.125IN) THICK, 99.999% (METALS BASIS)
- CAS
- CBNumberCB1660094
- MFH4Si
- MW32.11726
- MOL FileMol file