Basic information
SILICON SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS) Structure

SILICON SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS)

Preparation Products And Raw materials