Parylene F Dimer Struktur

Parylene F Dimer

Bezeichnung:Parylene F Dimer

CAS-Nr1785-64-4

Englisch Name:Parylene F Dimer

CBNumberCB61563607

SummenformelC16H8F8

Molgewicht352.22

MOL-Datei1785-64-4.mol

Parylene F Dimer physikalisch-chemischer Eigenschaften

Schmelzpunkt	>205 °C (sublm)
Siedepunkt	321 ºC
Dichte	1.497
Flammpunkt	117 ºC
storage temp.	2-8°C
Löslichkeit	soluble in Toluene
Aggregatzustand	powder to crystal
Farbe	White to Almost white
InChI	InChI=1S/C16H8F8/c17-9-5-1-2-6-11(19)15(23)8(16(24)12(6)20)4-3-7(13(9)21)14(22)10(5)18/h1-4H2
InChIKey	GUHKMHMGKKRFDT-UHFFFAOYSA-N
SMILES	C12C(F)=C(F)C(=C(F)C=1F)CCC1C(F)=C(F)C(=C(F)C=1F)CC2

Sicherheit

HS Code

2903.99.8001

Parylene F Dimer Chemische Eigenschaften,Einsatz,Produktion Methoden

Beschreibung
Parylene F Dimer is the solid, granular starting material used to produce parylene conformal coating films. Parylene F brings allows for parylene performance at higher operating temperatures, along with similar barrier and dielectric protection of other parylene types.
Physikalische Eigenschaften
TYPICAL PROPERTIES OF DEPOSITED PARYLENE F FILM
Gas Permeability, O2: 16.7 (cc*mm)/(m2*day*atm)
Short Term Service Temperature: 250℃
Continuous Service Temperature: 200℃
Coefficient of Friction (Static and Dynamic): 0.35
Rockwell Hardness: R80
Tensile Strength: 7,800 psi
Penetration Power: 30 X
Dielectric Strength @ 1 mil: 7.0 KV
USP Class VI Polymer: Yes
Verwenden
Parylene type materials have been widely used in electronic products, Parylene family of commercially valuable types of materials are divided into four types, respectively, Parylene N, Parylene C, Parylene F, Parylene Ht.
Parylene is applied with a vapor deposition process performed in a customized vacuum system. There is no curing involved. Typical coating thickness ranges from 2-50 microns.
Barrier layer protection for high temperature applications.
Protects devices from moisture, bodily fluids, corrosive gases, vapors, liquids and other contamination.
Waterproof electronics up to IPX8 protection level and meet requirements for IPC, MIL specs and NASA standards.
Prevents corrosion of printed circuit boards and electronic components.
Dielectric layer to protect electronics from shorts and arcing.
Thin film encapsulation is used to protect electronics from vibration or shock.
Tin whisker mitigation
benefits
Parylene F film meets all requirements of MIL-I-46058C, IPC-CC-830B and NASA-STD-8739.1 as type XY
USP Class VI biocompatibility
UL-94 V-0 flammability rating
No VOC's or solvents used in deposition process
RoHS and REACH compliant
Vapor deposition has a high penetration power and is extremely conformal
Deposition occurs in a vacuum chamber occurs at room temperature and does not exert any force during deposition
No curing cycle
Excellent barrier and dielectric properties
Chemically and biologically inert
Extremely thin and lightweight coating
No outgassing, approved by NASA
Hydrophobic
Able to sterilize with all common sterilization methods
Materials Uses
Parylene F dimer is restricted for use on Medical Devices and R&D use only.
Lager
Store in a cool, dark place in the original unopened container when not in use. Do not place in view of UV light source including sunlight. Dimer is not known to degrade when stored out of direct sunlight and below 30°C. Recommend retesting after five years from manufacturer date.

Parylene F Dimer Anbieter Lieferant Produzent Hersteller Vertrieb Händler.

1785-64-4, Parylene F Dimer Verwandte Suche:

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