SILICON SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 3.18MM (0.125IN) THICK, 99.999% (METALS BASIS)

SILICON SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 3.18MM (0.125IN) THICK, 99.999% (METALS BASIS),,结构式
SILICON SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 3.18MM (0.125IN) THICK, 99.999% (METALS BASIS)
  • CAS号:
  • 英文名:SILICON SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 3.18MM (0.125IN) THICK, 99.999% (METALS BASIS)
  • 中文名:
  • CBNumber:CB7660096
  • 分子式:H4Si
  • 分子量:32.11726
  • MOL File:Mol file
SILICON SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 3.18MM (0.125IN) THICK, 99.999% (METALS BASIS)上下游产品信息
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SILICON SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 3.18MM (0.125IN) THICK, 99.999% (METALS BASIS)生产厂家