ALD/CVD precursor for the preparation of Cu, Cu2O, or Cu2S films for electronic applications at temperatures ranging from 135 to 170°C. The TSubl = 90°C/0.05 Torr and has a decomposition temperature of 185-188°C.
Bis(dimethylamino-2-propoxy)copper(II), min. 98% Cu(dmap)2 Supplier
