Tetraammoniumpalladium(Ⅱ) sulfate is a new type of electroplating product. It integrates the advantages of various electrolytes, can enhance the ductility of the coating, and does not contain chlorine. It is especially suitable for low-ammonia electroplating processes and is an ideal electroplating solution.
Tetraamminepalladium(II) sulfate is a new type of electroplating product. It is used for palladium plating in the electronics industry. It is mainly used for coating computer motherboards and network plugs, and manufacturing automotive catalytic crackers. Due to its high electroplating efficiency, cleanliness and environmental protection, it has gradually replaced traditional products such as tetraammonium palladium nitrate.
Activated with hydrochloric acid to obtain highly active palladium powder, dissolved in nitric acid to obtain palladium nitrate (II) solution, added sulfuric acid to heat to volatilize part of the nitro groups, added ammonia water to obtain a solution containing tetraammoniapalladium (II) sulfate, added excess ammonia water to obtain sulfuric acid Tetraamminepalladium (II) crystals.
