Tungsten silicide (WSi2) is an inorganic compound, a silicide of tungsten. It is an electrically conductive ceramic
material. Tungsten silicide can react violently with substances such as strong acids, fluorine, oxidizers, and interhalogens.
It is employed in microelectronics as a contact material, with a resistivity of 60-80 μΩ cm; it forms at 1000℃. It is frequently used as a shunt over polysilicon lines to increase their conductivity and increase signal speed.
Blue-gray, very hard solid. Insoluble in water; attacked by fused
alkalies and mixture of nitric and hydrofluoric acids.
Oxidation-resistant coatings, electrical resistance
and refractory applications.
Tungsten silicide is used in microelectronics as a contact material. It is also used as a shunt over polysilicon lines to increase their conductivity and increase signal speed. Further, it acts as a barrier layer between silicon and other metals. In addition to this, it is used in microelectro mechanical systems and for oxidation-resistant coatings. It is also employed as a replacement for earlier tungsten films.