SILICON SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS) 化学構造式

SILICON SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS)

化学名:SILICON SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS)

CAS番号.

英語名:SILICON SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS)

CBNumberCB0660097

MFH4Si

MW32.11726