SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS) Struktur

SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS)

Bezeichnung:SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS)

CAS-Nr

Englisch Name:SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS)

CBNumberCB4660095

SummenformelH4Si

Molgewicht32.11726

MOL-DateiMol file