EPOXY Produkt Beschreibung

EPOXY Struktur
  • CAS-Nr.
  • Bezeichnung:EPOXY
  • Englisch Name:EPOXY
  • Synonyma:
  • CBNumber:CB31416320
  • Summenformel:O **
  • Molgewicht:15.9994
  • MOL-Datei:Mol file

EPOXY Chemische Eigenschaften,Einsatz,Produktion Methoden

  • Verwenden Epoxy is a high-performance adhesive largely used in the electronics industry as well as for MEMS and microfluidic applications. Some epoxies are cured by exposure to UV light and are commonly used in optical applications and dentistry. After cure, epoxies form strong bonds and smooth surfaces chemically inert to a large range of chemical substances, making them a good choice as sealing material as well as microchannels structural material. The strength of the epoxy adhesion is usually degraded at temperatures above 180°C.
EPOXY Upstream-Materialien And Downstream Produkte
Downstream Produkte
EPOXY Anbieter Lieferant Produzent Hersteller Vertrieb Händler.